Engineering Manager – Electronic Product Sustenance and CAD
Boeing
Bangalore, Karnataka
Permanent
Full-time
13 days ago
Job Description Job Description Job Description: Boeing is the world's largest (Per Boeing LinkedIn page) aerospace company and a leading provider of commercial airplanes, defense, space, and security systems, and global services. Building on a legacy of over a century of innovation and leadership, Boeing continues to lead the way in technology and innovation, customer delivery, and investment in its people and future growth of aerospace. In India, Boeing has been a strong partner to the Indian aerospace and defense sectors for more than 75 years. People at Boeing have been supporting mission readiness and modernization of India's defense forces, and enabling connected, safer, and smarter flying experiences, in the sky, in the seas, and in space. Technology for today and tomorrow The Boeing India Engineering & Technology Center (BIETC) is a 3000+ diverse engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace. People-driven culture At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring diverse perspectives and thoughts - enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work, we are committed to positively shaping people's careers and being thoughtful about employee wellbeing. At Boeing, we are inclusive, diverse, and transformative. With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace. Position Overview: Boeing India Engineering and Technology Center (BIETC) has a Job Opening for an Engineering Manager - Electronic Product Sustenance and CAD who will be responsible for development and management of engineers in India to perform engineering work-statements for Boeing products. This position will work collaboratively with the teams from across the globe in an integrated design environment to help deliver engineering statement of work. The selected individual will develop and manage Engineers, interact with the program leaders from across the globe. This position will be located in BIETC Campus, Bangalore, India and will be reporting directly to the Boeing India Engineering Senior Manager at Bangalore, India. We are looking for seasoned engineers with strong passion for customer focused solutions, insight, industry knowledge to envision and proven expert over Mentor solutions that will deliver high reliability and safety focused avionics hardware for multi-platform applications. Position Responsibilities: This position will be responsible to deliver hardware solutions that shall work reliably and safely for space, aviation and ground based applications to enable value generation across product lines for new configuration and solution deployment. The selected candidates should have strong awareness of Aerospace Electronic Hardware Development process. The candidate shall printed wiring board design process, sustainment of electronic hardware developed and lead SOI audits with suppliers. and electronics product delivery, product operation, in-service, maintenance and product disposal engineering activity. Facilitate interactions with cross functional engineering organizations to lead ebug collaboration projects with hardware, firmware and software teams through causal analysis and resolution techniques over reports arising from field and production. Lead and manage a lean development team for creation of printed wiring circuit board artifacts using Expedition. Build capability over analog, digital and mixed signal ECAD services for complex stackups over aerospace applications. Facilitate interactions with cross functional product engineering teams such as production, quality, equipment unit members and so on to enable team to execute re-entry to service plans. Project Planning and scheduling of activities of local team and present and report progress on regular basis. Accountable for leading execution forums and driving team meetings towards In service and production support resolutions Create, change control, modify and introduce documents and bulletins through the PLM tools. Issue resolution and root cause analysis Test Plan and its infrastructure development Address Systems-Hardware-Software-Production Development process in accordance with DO 254 processes and its sustenance, demonstrate through SOI Audit deployments though team. Collaborate, walk the high line, and help team deliver in a comprehensive capability. Deploy competitive technology roadmaps over printed wiring board designs for compact, thermally efficient and high throughput yield solutions while ensuring 100% quality. Use Data to effectively communicate with partners and stakeholders progress on design, development and production deliverables. Communication - strong written and verbal communication skills, ability to prepare comprehensive reports, proposals, Statements of Work, and connect technology to business considerations (e.g., ROI). Candidate must be fluent in English, and familiar with MS Office tools. Will take a particular team through successful stage gate reviews like requirements reviews, design reviews, test reviews, quality reviews, production readiness reviews at a minimum. Develop training plans for talent reviews and people competency development plans. Basic Qualifications (Required Skills/Experience): Bachelors or Master's degree is required. 13 to 16 Years of experience of technical engineering experience, has delivered dense processor based printed wiring boards, power supply and mixed signal printed wiring boards Has led at least two complete SOI audits across DO-254 processes. Thorough knowledge of aerospace engineering standards for design, testing & certification. Experience in PLM Tools, created ECO/ECN/PCR to be able to distribute resolution activities to various functional groups. Experience in Configuration Management, demonstrated leading proposals through a change management board. Experience with standards such as DO-160, DO-254 and MIL-STD-810, or equivalent commercial industry standards with a high focus on SIL needs Understands PMA/STC and other equivalent processes Strong knowledge on IPC standards Self-Motivated and ability to work independently and sometimes under extreme pressure Ability to work with different functional and delivery teams. Candidate must be a self-starter with a positive attitude, high ethics, and a track record of working successfully under pressure in a time-constrained environment. Preferred Qualifications (Required Skills/Experience): 2+ Years in managing Printed wiring Board Design teams. Field support experience, relevant to Avionics. Demonstrated engineering leadership experience in a major aerospace organization ability to understand and communicate with USA based Executives/managers, and expert over a wide range of engineering disciplines. 5+ years of experience managing large teams and independently delivering work statements. Typical Education & Experience: Education/experience typically acquired through advanced education (e.g. Bachelor) and typically 13+ or more years' related work experience or an equivalent combination of education and experience (e.g. Master 12+ years' related work experience.) Relocation: This position offers relocation within India. Export Control Requirements: Not an export control position Equal Opportunity Employer: We are an equal opportunity employer. We do not accept unlawful discrimination in our recruitment or employment practices on any grounds including but not limited to race, color, ethnicity, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military and veteran status, or other characteristics covered by applicable law. We have teams in more than 65 countries, and each person plays a role in helping us become one of the world's most innovative, diverse and inclusive companies. We are proud members of the and welcome applications from candidates with disabilities. Applicants are encouraged to share with our recruitment team any accommodations required during the recruitment process. Accommodations may include but are not limited to: conducting interviews in accessible locations that accommodate mobility needs, encouraging candidates to bring and use any existing assistive technology such as screen readers and offering flexible interview formats such as virtual or phone interviews.
