
PDN Engineer
- Bangalore, Karnataka
- Permanent
- Full-time
Hardware EngineeringGeneral Summary:As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
- IR Signoff for High Performance NPU Cores.
- Signal EM & Power EM Signoff for High Performance DSP Cores.
- Development of PG Grid spec for different DSP cores.
- ESD Signoff for High Performance DSP Cores.
- Validating the PG Grid using Grid Resistance & Secondary PG Resistance Checks
- Validating the IR Drops using Static IR , Dynamic IR Vless & VCD Checks for validating Die & Pkg Components of IR Drops.
- Working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations to improve overall PDN Design.
- Good knowledge on PD would be helpful.
- Perl , TCL Scripting Skills.
- Hands - on experience in PDN Signoff using Redhawk / RHSC / Voltus at block level / SOC Level.
- Good understanding on Power Integrity Signoff Checks.
- Proficient in scripting languages (Tcl and Perl).
- Familiarity with Innovus for RDL / Bump Planning.
- Ability to communicate effectively with multiple global cross-functional teams