PCB Design Engineer (High-Speed / Mixed Signal)

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  • Coimbatore, Tamil Nadu
  • Permanent
  • Full-time
  • 12 hours ago
  • Apply easily
PCB Design Engineer (High-Speed / Mixed Signal)
  • Location: Coimbatore
  • Work Mode: Onsite
  • Experience: 2 3 Years
  • Open Positions: 5
1. Role OverviewWe are looking for a PCB Design Engineer with hands-on experience in high-speed and mixed-signal board design. The role involves working across the complete PCB design lifecycle, from schematic capture to Gerber release. The candidate will handle medium to high complexity designs and collaborate with cross-functional engineering and manufacturing teams. 2. Key Responsibilities
  • Develop and review schematic designs based on system requirements
  • Create and maintain PCB symbols, footprints, and component libraries as per IPC standards
  • Perform PCB layout considering signal integrity, power integrity, EMI/EMC, and DFM/DFA guidelines
  • Design and route high-speed interfaces such as DDR3/DDR4/DDR5, LPDDR, PCIe, USB, Ethernet, HDMI/DP, MIPI, SATA
  • Implement controlled impedance routing, length matching, differential pair routing, and via optimization
  • Design boards with BGA, fine-pitch components, HDI, blind and buried vias
  • Define stack-up, component placement, and routing for 2-layer to multilayer PCBs
  • Generate manufacturing outputs including Gerber files, drill files, pick-and-place, and fabrication drawings
  • Conduct schematic/layout reviews and implement engineering change orders (ECOs)
  • Coordinate with fabrication and assembly vendors for issue resolution
  • Support prototype bring-up, testing, and debug activities
  • Ensure design compliance with quality, cost, and timeline requirements
3. Required Qualifications
  • Bachelor's degree in Electronics / Electrical Engineering (EEE/ECE)
  • 2 3 years of experience in PCB design and layout
  • Experience across full PCB design flow (schematic to manufacturing release)
4. Technical Skills (Structured)PCB Design & Layout:
  • Schematic capture, PCB layout design
  • Multilayer board design and stack-up planning
  • Footprint and library creation (IPC standards)
High-Speed & Interfaces:
  • DDR3/DDR4/DDR5, LPDDR
  • PCIe, USB, Ethernet, HDMI/DisplayPort, MIPI, SATA
  • Signal integrity (SI) and power integrity (PI) fundamentals
Routing & Constraints:
  • Controlled impedance routing
  • Differential pair routing
  • Length matching and timing constraints
  • Via optimization
EDA Tools:
  • Allegro, Altium Designer, Mentor Expedition
  • OrCAD, PADS, CR5000/CR8000, CADSTAR
Manufacturing & Standards:
  • Gerber generation, fabrication and assembly outputs
  • DFM/DFA guidelines
  • EMI/EMC basics
  • PCB materials, stack-ups, fabrication processes
Circuit Design Exposure:
  • Analog, digital, and power circuit design fundamentals
5. Good to Have (Optional)
  • Experience in HDI PCB design and multilayer stack-up optimization
  • Exposure to mixed-signal board design
  • Understanding of power integrity (PI) concepts
  • Experience with multiple EDA tools
  • Basic knowledge of BOM management and component selection
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