Die-Package co-design flow & methodology engineer

NXP Semiconductors

Bangalore, Karnataka
Permanent
Full-time

1 month ago

ContextNXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,000 employees in more than 30 countries.Design Enablement is a central technology development organization within NXP which defines and supports NXP hardware design methodologies and EDA tools enabling differentiation for NXP IP/SOC development.In this job you will drive the development, testing and maintaining of state-of-the-art IC-package co-design tool and flow. You will be working within the department of Design Enablement Engineering Support and in close collaboration with RF-EM Design Enablement department in NXP CTO. The work is performed in close co-operation with the back-end design team, package innovation team, other design enablement departments, business line designers and architects, and leading EDA vendors.You will need to gather requirements and design team needs, assess the available tooling that exists in the EDA market, evaluate the solution on NXP designs and work in close collaboration with multiple departments to understand limitation and applicability of such tools and flows within NXP design community. You will also support designers with know-how to deploy the developed solution across the business lines design teams. Additionally, you will work together with electromagnetic experts in the RF-EM Design Enablement department to enable seamless integration if of co-design flow with electromagnetic simulations and interference analysis flows.Your ResponsibilitiesYour key areas of responsibility will be derived from the following elements, based on requirements and customer specifications:

Collect the requirements and specifications for co-design flow of IC, Package (and eventually PCB) in close cooperation with the design teams.
Create a flow that unify the entire design fabrics (IC, Package, and PCB) into a common design environment with well-known EDA tools.
Propose recommendation for flow optimization and characterization of the designs under development.
Manage the tool & flow verification and regression testing in an efficient way towards automation.
Provide guidelines and recommendations to the design team on how to use of newly developed flows.
Cooperate with EDA vendors (bugfixes, enhancement requests, etc.) in sync with the design and package innovation teams.
Align co-design flow with flows and methodologies that will be used for electromagnetic simulations,
Document findings in a form of technical reports and provide recommendations to the design teams.
Contribute to the overall improvement of the existing design flows and methodologies.

Additionally, you can also contribute to the following activities:

Develop / maintain a broad knowledge of technical developments in the IC design domain.
Provide first-line and expert support for co-design of die, package & PCB to the design community.
Contribute to improvements in next-generation RF designs (Radar, 6G, Radio, …).

Your profile:

Master’s degree in Electronics engineering, Electrical Engineering, Applied Physics
Familiar with the Analog – RF IC, IC package, PCB design process in general is must.
Advanced industrial experience in Analog and RF domain (die, package and PCB) is recommended, especially knowledge of Cadence Virtuoso for IC designs and Cadence Allegro for package and PCB designs is highly recommended.
Expert user of Cadence (Virtuoso RF, Allegro), Ansys-HFSS, ADS-RFPro is a plus.
Minimum 2 years of experience in IC and package design.
knowledge of Electromagnetic 2.5 / 3D simulations, specifically with available commercial tools is plus.
Knowledge with programming languages in a plus.
Excellent communication skills and team player.
Proficient in communicating and writing technical documentation in English.
Able to work in a dynamic environment.

NXP Semiconductors

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